Acrylic Resin for Firing Paste

Product Description

This acrylic resin is used for various paste applications. Uses include electrode pastes for multilayer ceramic capacitors (MLCCs), which require firing processes.
Soken's proprietary technology has been used to improve the stringiness in acrylics, which has been a problem previously, resulting in excellent printability.
We offer products that balance firing and printing properties, as well as others designed specifically for firing. These products are suitable not only for firing but also for dip coating with less stringiness, and screen printing that requires thixotropic properties.

Acrylic Resin for Firing Paste

Characteristics

  • Firing properties
  • Printability
  • Spinnability
  • Thixotropy
  • Film density
  • Adhesion to substrates

Features

SPB-80
  • Viscoelastic properties not found in conventional acrylic resins
  • Dispersion stability with metal fillers
  • Printability comparable to ethyl cellulose (EC)
M-4000 Series
  • Specific firing properties
  • Especially low residual carbon content after firing
  • Also available for sale in particle form

Applications

  • MLCC external and internal electrodes
  • Resins for various pastes

Application Examples

Capacitor Firing Process
Capacitor Firing Process

Grade and Product Number

*Can be scrolled horizontally

Product no. Solvent type *1 Viscosity (ηPa·s at 25°C) Heating residue*2
(%)
External appearance *3 Features
SPB-80 DHT Approx. 45 Approx. 30 Colorless to light brown transparent liquid EC-equivalent thread breakage
M-4100 Terpineol Approx. 218 Approx. 27 Pale yellow, slightly turbid liquid Low residual carbon content
M-4200 Terpineol Approx. 125 Approx. 35 Pale yellow, slightly turbid liquid Low residual carbon content
M-4210 DHT Approx. 58 Approx. 30 Pale yellow, slightly turbid liquid Low residual carbon content
  • *1 DHT: dihydroterpineol
  • *2 Proportion of weight remaining after heating at 150°C for 3 hours.
  • *3 Visual evaluation

Thermal Properties

Good firing properties and low residual carbon content after heating, even in a nitrogen atmosphere.

In an air atmosphere
In an air atmosphere
In a nitrogen atmosphere
In a nitrogen atmosphere

*Can be scrolled horizontally

  Pyrolysis (in an air atmosphere)*1 Pyrolysis (in a nitrogen atmosphere)*2
Initial temperature Final temperature Residual carbon content Initial temperature Final temperature Residual carbon content
EC (ref) 315℃ 465℃ Less than 1% 327℃ 516℃ 7.2%
SPB-80 262℃ 301℃ Less than 1% 301℃ 457℃ Less than 1%
M-4100 Approx. 220℃ Approx. 290℃ Less than 1% Approx. 180℃ Approx. 340℃ Less than 1%
M-4200 Approx. 250℃ Approx. 290℃ Less than 1% Approx. 260℃ Approx. 390℃ Less than 1%
M-4210 Approx. 250℃ Approx. 290℃ Less than 1% Approx. 260℃ Approx. 390℃ Less than 1%
  • *1Temperature increased to 700°C at 0°C min-1 in an air atmosphere.
  • *2 Temperature increased to 700°C at 10°C min-1 in a nitrogen atmosphere.

Viscoelasticity

*Can be scrolled horizontally

  Ethyl cellulose (ref.) SPB-80 M-4210
Pseudoplasticity *1 150 50 16
Thixotropy *2 3–4 3.3 1.6
Spinnability *3 3 s 4 s 9 s
  • *1 Viscosity ratios at shear rates of 1 s-1 and 3,000 s-1 (the larger the value, the greater the change in viscosity with stress).
  • *2 Viscosity ratios with rate increase and decrease at a shear rate of 1,000 s-1 (the smaller the value, the more rapid the viscosity increase [recovery] when the rate decreases).
  • *3 Time until stringiness is eliminated in DHT solution at 5 Pa·s (the shorter the time, the lower the stringiness).

Dip Coating

Ethyl cellulose (EC)
Ethyl cellulose (EC)
SPB-80
SPB-80

Micro-Residual Carbon Content

*Can be scrolled horizontally

Sample EC PVB PMMA M-4200
Micro-residual carbon content (%) 9.8 2.5 0.2 0.02
Photographs after Measurement of Micro-Residual Carbon Content (Temperature: 500°C; in a Nitrogen Atmosphere)
EC
EC
PVB
PVB
PMMA
PMMA
M-4200
M-4200

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Performance Materials

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  • Note: The data listed are for reference only and are not standard values.
    In addition, there is no guarantee that the listed uses will not infringe on any patents.